Publications
SIRI Lab
No. | Authors | Title | Journal/Volume/Page | Year | Link |
1 | Chun-Hao Chen, Pei-Ing Lee, and Tung-Han Chuang | Microstructure Evolution and Failure Mechnanism of Electromigration in Ag-alloy Bonding Wire | Journal of Alloys and Compounds, Vol. 913, pp. 165266 | 2025 | |
2 | Tung Han Chuang, Jim Wang, Yin Hsuan Chen, Chun Hao Chen, Ang Ying Lin, Jing Yao Chang, Jung Hsuan Chen, and Wei Chung Huang | Development of Ag Nanotwinned Film Coated Pre-Formed Silver Sintered Sheets for the Die Bonding of SiC Chips with DBC Ceramic Substrates | Key Engineering Materials, Vol. 1034, pp. 89-96 | 2025 | |
3 | Chee-How Lu, Xiang-You Ye, Chih-Yi Yang, TSung-Ying Yang, You-Chen Weng, Jui-Sheng Wu, Chun-Hao Chen, and Edward-Yi Chang | Ultra-low leakage current recess-free thin barrier AlGaN/GaN Schottky diodes featuring hybrid MOS/MIS GET anodes with optimized MOS-gate length and LPCVD SiNx thickness | Japanese Journal of Applied Physics, Vol. 64, No. 7, pp. 070908 | 2025 | |
4 | You-Chen Weng, Fu-Kai Tsai, Chee-How Lu, Chih-Yi Yang, Chun-Hao Chen, Jui-Sheng Wu, Min-Lu Kao, Hao-Chung Kuo, and Edward Yi Chang | Optimization of n-Type GaN Grown by MOCVD for Low Contact Resistance | In 2025 22nd International Workshop on Junction Technology (IWJT), pp. 72-74 | 2025 | |
5 | Chun-Hao Chen, Anne Groth, Marvin Jügel, Martin Hempel, Tzu-Ting Huang, and Thi Minh Anh Dao | Ultrasonic Bonding of AlCu Wire – An Advance to Reliable Interconnects for Power Modules | In 2025 International Spring Seminar on Electronics Technology (ISSE), pp. 1-4 | 2025 | |
6 | Hsien-Chung Tang, Chun-Hao Chen, Edward-Yi Chang, Da-Jeng Yao, Wei-Hua Chieng, and Jun-Ying He | A Long-Range, High-Efficiency Resonant Wireless Power Transfer via Imaginary Turn Ratio Air Voltage Transformer | Energies, Vol. 18, No. 6, pp. 1329 | 2025 | |
7 | Yin-Hsuan Chen, | Enhancement of Ag sintering reactions through high-density (111) orientation Ag nanotwins for the die bonding of SiC chips with DBC alumina substrates | Journal of Materials Science: Materials in Electronics, Vol. 36, No. 382 | 2025 |
No. | Authors | Title | Journal/Volume/Page | Year | Link |
1 | Chun-Hao Chen, Meng-Ting Chiang, and Tung-Han Chuang | Investigation of Creep Failure in Ag-4Pd Bonding Wire Under Dynamic Mechanical Analysis Tests | IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 13, pp. 1944–1950 | 2023 | |
2 | Chun-Hao Chen, Yan-Cheng Lin, Po-Ching Wu, Tung-Han Chuang | Formation of Ag Dendrites during the Electrolytic Migration between Ag-4Pd Wire Couple in Water under Bias | JOM: the journal of the Minerals, Metals & Materials Society | 2023 | |
3 | Chun-Hao Chen, Chung-Lin Yang, and Tung-Han Chuang | Intermetallic Growth and Thermal Impedance at the In32.5Bi16.5Sn/Cu Interface | Journal of Alloys and Compounds, Vol. 936, pp. 168309 | 2022 | |
4 | Chun-Hao Chen, and Tung-Han Chuang | Optimization of Ag-alloy Ribbon Bonding — An Approach to Reliable Interconnection for High Power IC Packaging | Microelectronics Reliability, Vol. 137, pp. 114786 | 2022 | |
5 | Chun-Hao Chen, Chia-Yu Lee, Ming-Der Ger, Shun-Yi Jian, Jung-Chou Hung, Po-Jen Yang, Chun-Hsiang Kao, Yi-Cherng Ferng, Ying-Sun Huang, and Kuo-Kuang Jen | The Effect of Oxalic Acid as the Pre-Activator for the Electropolishing of Additive Manufactured Titanium-Based Materials and Its Characterization | Polymers, vol. 14(19), pp. 4198 | 2022 | |
6 | Chun-Hao Chen, Pei-Ing Lee, and Tung-Han Chuang | Microstructure evolution and failure mechanism of electromigration in Ag-alloy bonding wire | Journal of Alloys and Compounds, Vol. 913, pp. 165266 | 2022 | |
7 | Chun-Hao Chen, Pei-Ing Lee, Wei-Ting Yeh, and Tung-Han Chuang | Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes | Metallurgical and Materials Transactions A, vol. 53, pp. 136–146 | 2022 |
No. | Authors | Title | Journal/Volume/Page | Year | Link |
1 | Chun-Hao Chen, Yu-Kai Sun, Yu-Chang Lai, Shih-Ying Chang, and Tung-Han Chuang | Effect of Post-Weld Heat Treatment on the Solid-State Diffusion Bonding of 6061 Aluminum Alloy | Applied Sciences, vol. 11(20), pp. 9660 | 2021 | |
2 | Yan-Cheng Lin, Pei-Ing Lee, Po-Ching Wu, Chun-Hao Chen, and Tung-Han Chuang | Effects of grain Size on the Ag dissolution and ion migration of Ag-4Pd alloy wires | Journal of Electronic Materials, vol. 50, pp. 5955–5964 | 2021 | |
3 | Chun-Hao Chen, Wei-Ting Yeh, Tung-Han Chuang | Interfacial Reactions in Zn4Sb3/Titanium Diffusion Couples | Journal of Alloys and Compounds, Vol. 881, pp. 160630 | 2021 | |
4 | Chun-Hao Chen, Yu-Chang Lai, Tung-Han Chuang | Grain growth and twin formation in a Ag-4Pd alloy ribbon after annealing treatments | Journal of Alloys and Compounds, vol. 863, pp. 158619 | 2021 | |
5 | Chun-Hao Chen, Shih-Wen Hsu, and Tung-Han Chuang | Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging | Journal of Electronic Materials, vol. 50, pp. 249–257 | 2021 |
No. | Authors | Title | Journal/Volume/Page | Year | Link |
1 | Tung-Han Chuang, Shih-Wen Hsu, and Chun-Hao Chen* | Intermetallic Compounds at the Interfaces of Ag–Pd Alloy Stud Bumps With Al Pads | IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 10, pp. 1657–1665 | 2020 | |
2 | Chun-Hao Chen, Yan-Cheng Lin, Anne Groth, Yu-Chang Lai, Chia-Yin Lin, Heng-Ming Chang, Tung-Han Chuang | Ultrasonic Bonding of Ag and Ag-alloy Ribbon – an innovative alternative for High Power IC Packages | IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 6, pp. 1061–1068 | 2020 | |
3 | Tung-Han Chuang, Shih-Wen Hsu, Yan-Cheng Lin, Wei-Ting Yeh, Chun-Hao Chen, Pei-Ing Lee, Po-Ching Wu, and Hao-Peng Cheng | Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi0.5Sb1.5Te3 Thermoelectric Material and a Cu Electrode | Journal of Electronic Materials, vol. 49, pp. 3391–3399 | 2020 |
No. | Authors | Title | Journal/Volume/Page | Year | Link |
1 | Tung-Han Chuang, and Chun-Hao Chen | Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires | Metallurgical and Materials Transactions A, vol. 49, Issue 11, pp 5904–5910 | 2018 | |
2 | Yan-Cheng Lin, Chun-Hao Chen, Yu-Zhen He, Sheng-Chi Chen, and Tung-Han Chuang | Electrolytic Migration of Ag-Pd alloy Wires with various Pd contents | Journal of Electronic Materials, vol. 47, Issue 7, pp. 3634–3638 | 2018 | |
3 | Chun-Hao Chen, Yan-Cheng Lin, Yu-Ting Shih, Sheng-Chi Chen, Chih-Hsin Tsai, Shang-Chih Wang, Tung-Han Chuang | Evaluation of Corrosion Resistance of Ag-alloy Bonding Wires for Electronic Packaging | IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 1, pp. 146–153 | 2018 |
No. | Authors | Title | Journal/Volume/Page | Year | Link |
1 | Hsing-Hua Tsai, Chih-Hsin Tsai, Jun-Der Lee, Dennis Chang, Yu-Ting Shih, Chun-Hao Chen, Tung-Han Chuang | Applications of Ag-alloy stud bump for IC and LED packages | 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) | 2014 |