Members
SIRI Lab
PhD Students
Dao
Thi Minh Anh
陶氏明英
Vietnamese
Nathan
林群恩
Taiwanese
Masters Students
Daniel
蔡東洲
Taiwanese
Polina Leger
波莉娜
American
Henry
阮明孝
Vietnamese
Gayathri Devi
Indian
Haris
Indian
Yu-Fang Chien
簡于芳
Taiwanese
Yun-Ting Hung (Emily)
洪韵婷
Taiwanese
Yu-Chen Lin (Nancy)
林妤蓁
Taiwanese
Chen Hsin (Scott)
陳昕
Taiwanese
Alice Du
杜宇彤
Taiwanese
Dhanya Sree
丹妮亞
Indian
Yoke Joo Tang
陈育柔
Malaysian
Hoang Thi Linh
黃氏玲
Vietnamese
Shao-Fu Chang (William)
張少輔
Taiwanese
Pham Phuc Huy
范福輝
Vietnamese
Nguyen Son Lam
阮山林
Vietnamese
Karina
鄭淑慧
American
Nguyen Anh Tuan
阮英俊
Vietnamese
Yijie Chen
陳怡潔
Taiwanese
HsinYun Wang
王心芸
Taiwanese
Yu-Wen Lai
賴昱雯
Taiwanese
Elisha Torres
伊莉莎
Belizean
Hank Lin
林昕翰
Taiwanese
Do Thu Huong
杜秋香
Vietnamese
Alumni
2026
Anis Khairunnisa
- Company:
- Master’s Thesis Title: Study on the Development of Power Cycling Test Platform for Reliability Evaluation of Power Modules
Alex 馬克彥
- Company:
- Master’s Thesis Title: Interfacial Reaction of Indium Thermal Interface Materials with Backside Chip Metallization and Its Influence on Thermal Resistance for Advanced Packaging Tim1.5
Johnny 葉育辰
- Company:
- Master’s Thesis Title: Development of a System-on-Chip-Based Active Power Cycling Platform for Power Device Reliability Assessment
Tzu-Ting Huang 黃子庭
- Company:
- Master’s Thesis Title: Study on Electro-Thermal Characteristics and Reliability of GaN HEMTs using Power Cycling Test
Amr Elmenoufy
- Company:
- Master’s Thesis Title:
Hoang Phuong Thao
- Company:
- Master’s Thesis Title:
2025
Adam 江彥侖
- Company: Utechzone
- Master’s Thesis Title: Nanotwin-Enabled SiC Power Module Interconnects: Backside Ag Preform Die Attach and Frontside Heavy Cu Wire Bonding
Dao Thi Minh Anh
- Company: Continue PhD
- Master’s Thesis Title: Study on Nanotwinned Silver Metallization for heterogenous Bonding of Cu Clip Interconnects and Cu-Stainless Steel Baseplate interfaces in Power Modules
Yu-Ning Su 蘇鈺甯
- Company:
- Master’s Thesis Title: Study on the Development of Power Cycling Test bench and Reliability Test for GaN HEMT Power Devices
2024
Thu-Tram Nguyen
- Company: Micron
- Master’s Thesis Title: Investigation of HfNX/Al2O3-based Conductive Bridge Random-Access Memory Device