Research Topics
SIRI Lab
Advanced Packaging Materials
As the semiconductor industry advances beyond the age of simple scaling, it becomes imperative to go beyond device engineering and analyze new materials. While new materials are revolutionizing all aspects of the industry from superconductors to new transistor channels, the oft-neglected ultra-important category of advanced packaging materials is essential to efficient device function. More now than ever, interconnections need to be reliable under high temperatures and electrical stress. Therefore, SIRI lab works on investigating and improving various state-of-the-art interconnection technologies such as silver sintering paste, heavy wire bonding, nanotwinned material, and thermal interface materials. Additionally, SIRI lab uses EBSD characterization for identifying and improving these interconnections.
