SIRI

At the System Integration & Reliable Interconnects (SIRI) Lab at NYCU we specialize in power semiconductor packaging technologies, primarily GaN and SiC-based devices. The balance between high performance and power efficiency in the ever-scaling semiconductor industry has demanded new materials beyond Silicon to compensate for large power and temperature needs. Wide-bandgap semiconductors continue to revolutionize power electronics due to their superior electrical and thermal properties. As such, our research aims to develop high-reliability packaging solutions that maximize their performance. 

Our lab is not only aimed at creating the next generation of power device packaging technology but also equipping students with the technical skills and bigger-picture thinking to develop high-efficiency and high-power-density devices. As part of SIRI Lab, you will have the chance to work with state-of-the-art fabrication and packaging tools such as sputtering and evaporation systems for thin-film deposition, thermal imaging for in situ temperature characterization, wire bonders, die bonders, and thermocompression bonders. You can be confident that our researchers become competent in important skills such as device fabrication, process integration, and reliability assessment. With opportunities to publish in high-impact journals, present at international conferences, and collaborate with industry leaders, our students are well-prepared for careers in both academia and the semiconductor industry. We welcome motivated students with backgrounds in materials science, electrical engineering, or mechanical engineering, who are eager to advance power semiconductor packaging technology.